3D High Density Wave Interconnects

Nuvotronics has developed and optimized the PolyStrataTM process for the fabrication of intricate microwave and millimeter-wave devices. These devices have primarily been rectangular coaxial transmission lines, although rectangular waveguide and other structures have also been demonstrated. Intricate devices have been demonstrated with insertion loss 5 to 10 times lower than traditional planar circuits; isolation better than 60dB for lines that share separating walls; multiple levels of densely-packed coaxial circuits; and low-parasitic attachment to active devices and traditional circuit boards. In this Phase II project, Nuvotronics will optimize and fabricate high density low-loss millimeter backplane circuits to package and interconnect components of future NASA millimeter wave (MMW) radars. The significance of the innovation primarily lies in three areas: reduction of system size, weight and loss in MMW radars. The PolyStrata technology is a batch manufacturing process, providing economies of scale and cost reduction for higher volumes, in addition to flexibility in design for various frequencies of interest.

This is a mature technology (TRL 7+) — the realistic path in is usually NASA's Technology Transfer Program: licensing an existing NASA patent, or a Space Act Agreement to use NASA facilities/expertise directly. NASA also runs a startup licensing program with no upfront fee for companies formed to commercialize a specific NASA technology.

None of these are guaranteed paths for this specific project — TechPort itself doesn't have an "apply" button. Reaching out to the contact(s) above with a specific question is usually the fastest way to find out what's actually open.