Chemical Mechanical Planarization technology empowering next generation astrophysics instruments

Completed TRL 1 (started at 1, targeting 1)

Description

Chemical Mechanical Planarization (CMP) is a new approach for fabricating large format, high yield, and high feature density detector arrays. We propose to develop CMP processes customized for materials significant for NASA detector technologies.

Benefits

1) Eliminate step coverage issues and thus significantly improve yield and reliability of microfabricated circuits

2) Enhance component density by facilitating multilayer circuits and thus large focal planes

Details

Technology area	Sensors and Instruments > Remote Sensing Instruments and Sensors > Detectors and Focal Planes
Program	Center Independent Research & Development: GSFC IRAD (GSFC IRAD)
Lead organization	Goddard Space Flight Center, Greenbelt, MD
Start date	2021-10-01
End date	2022-09-30

Project contacts

Listed on TechPort itself — the most direct way to ask about this specific project.

David H Richardson — david.h.richardson@nasa.gov
Keith M Jahoda — keith.m.jahoda@nasa.gov
Archana M Devasia — archana.m.devasia@nasa.gov
Thomas R Stevenson — thomas.r.stevenson@nasa.gov

How to get involved

This is early/mid-stage (TRL 1) — the most realistic path in is NASA SBIR/STTR, which funds small businesses and research institutions to develop technology aligned with NASA's needs (equity-free, phased funding). Check whether a current SBIR/STTR solicitation topic overlaps with this project's technology area, or contact the project directly (above) to ask.

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