Earth-observing PIC – Component Development (EPIC)

Imaging spectrometers based on photonic integrated circuits (PICs) are poised to take advantage of rapid advances in nanofabrication to revolutionize the capabilities of remote sensing instruments in Earth Science. Interferometric imagers based on PIC devices have long been envisioned as a revolutionary sensor technology that can dramatically reduce the size, weight, and power (SWaP) of optical instruments (sensors) by eliminating the need for a traditional telescope and active optics. Eliminating components and reducing the requirements for alignment, together with the production efficiencies associated with wafer fabrication, can dramatically reduce costs for constellations of sensors. Lockheed Martin (LM) has unique resources and the institutional heritage to develop an Earth-observing PIC (EPIC) Multispectral Aerosol Polarimeter (MAP) for Earth Science. In this proposal we describe the definition, design, fabrication, and optimization plan for the fundamental PIC component of an imaging spectropolarimeter. Low-SWaP and low-cost instrumentation that can be manufactured at scale will increase the number of sensors available to future Earth Science missions. Increasing the number of sensors will enable measurements that require multiple (simultaneous) vantage points. Additional sensors on orbiting platforms will improve revisit times and the frequency of sampling. Redundancy and reliability also both improve with the number of sensors. The proposed component development addresses Earth Science mission objectives that dramatically benefit from multiple, low-cost sensors. This work will be performed from Jan 1, 2023 to Dec 31, 2024, and our objective is to fabricate the optimized component that will demonstrate the viability of future PIC instrumentation. We will demonstrate the polarization sensitivity and selectivity that is required for the remote characterization of aerosol. We will optimize end-to-end instrument throughput with a goal of achieving model-predicted insertion losses (IL) for the structures designed on the PIC. We will develop a sub-structure level insertion loss budget for the PIC during development and characterization that will guide instrument design as the PIC component is scaled to the performance requirements of an EPIC MAP mission. The Entry TRL the PIC technology is 2 and the Exit TRL is 4. The four proposed tasks are to: (1) optimize waveguide grating coupler performance, (2) microfabricate -- 3D print -- lenslets for free-space coupler onto gratings, (3) optimize and test coherent combiner performance, and (4) assemble and characterize the optimized fundamental PIC component. The methodology for each task differs in technical detail, but in general follows the cycles of learning, which a series of iterative steps to design, fabricate, and test a particular sub-component of the PIC for optimization. The proposed work is relevant to NASA ESTO Advanced Component Technology (ACT) program priorities, specifically the "particular focus on instrument subsystems and components based on integrated photonic circuits" noted in the ACT solicitation. This effort advances a rapidly emerging technology that is both broadly applicable to future imaging instruments as well as being specifically related to the Earth system observing objective of aerosol characterization

Accelerate mission development and reduce risk by developing critical components and subsystems for advanced instruments and observing systems

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