← Back to NASA Technology Projects

Flow Boiling in Microgap Coolers for 3D Integrated Circuits, Year 2

Completed TRL 4 (started at 3, targeting 4)

Description

The proposed approach, which facilitates integration of coolant channels within a silicon based micro-heat exchanger, offers high heat flux cooling, reduces heat exchanger size, minimizes the thermal resistance between the heat source and sink (thus reducing radiator size), and negates gravity effects on the two-phase coolant flow. The proposed effort will assess the thermal capabilities of two-phase cooling in electronic components, continue FY15 orientation independence studies, and begin to quantify system-level space, weight, and power advantages. The FY15 effort 1) demonstrated stable flow boiling in 100_m channels, such as those expected between adjacent dies in a 3D chip stack, at heat fluxes as high as 41 W/cm2; 2. achieved a COP of 28, and 3) advanced the TRL from 2 to 3. FY16 efforts will bring the technology to TRL 4.

Benefits

Fundamental Engineering Research focusing on 2-phase thermophysics in microgravity environment

Details

ProgramCenter Innovation Fund: GSFC CIF (GSFC CIF)
Lead organizationGoddard Space Flight Center, Greenbelt, MD
Start date2015-10-01
End date2016-09-30

Project contacts

Listed on TechPort itself — the most direct way to ask about this specific project.

How to get involved

This is early/mid-stage (TRL 4) — the most realistic path in is NASA SBIR/STTR, which funds small businesses and research institutions to develop technology aligned with NASA's needs (equity-free, phased funding). Check whether a current SBIR/STTR solicitation topic overlaps with this project's technology area, or contact the project directly (above) to ask.

None of these are guaranteed paths for this specific project — TechPort itself doesn't have an "apply" button. Reaching out to the contact(s) above with a specific question is usually the fastest way to find out what's actually open.