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Completed TRL 3 (started at 2, targeting 3)
This project will involve developing an innovative, 3-D manifold-microchannel design using additive manufacturing techniques, which includes microfabrication of electronics samples in SiC with integrated cooling channels. By the end of FY21, we plan to select an optimal working fluid for this application and test the electronic samples with a flow loop to meet chip-level heat dissipation targets that are typically seen in high-powered electronics (100 W/cm2). This structure was previously manufactured as silicon-based 3-D manifold. However, this will be the first time that a SiC-based 3-D manifold architecture will be microfabricated and tested for this application. If successful, further analytical research will be conducted to improve the design so that it can achieve greater heat dissipation targets and determine next steps for infusion into NASA technology.
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This is early/mid-stage (TRL 3) — the most realistic path in is NASA SBIR/STTR, which funds small businesses and research institutions to develop technology aligned with NASA's needs (equity-free, phased funding). Check whether a current SBIR/STTR solicitation topic overlaps with this project's technology area, or contact the project directly (above) to ask.
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