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Completed TRL 6 (started at 5, targeting 6)
High substrate costs limit the proliferation of many next-generation semiconductor device applications, such as high-efficiency GaAs-based photovoltaics for space applications, often consuming 50% of the cell manufacturing cost. We propose a novel substrate re-use technology, known as Sonic Lift-off (SLO), to drive down the costs of space photovoltaic manufacturing. SLO utilizes sound to separate thin devices from their host substrate, leaving the remaining substrate available for multiple reuses. A key milestone in the march towards commercialization is the ability to demonstrate the technology at industrially relevant wafer diameters and on real-world functioning devices. In this proposal we plan to build upon our successes to date in Phase I, moving from 4" wafer SLO feasibility to functioning 4" device feasibility and optimization. For this effort, a new SLO alpha tool ('Gen2') will be built and operated in order to demonstrate overall performance.
Potential NASA Applications: Substrate re-use of GaAs photovoltaic devices for space.
Potential Non-NASA Applications: A wide range of emerging next-generation semiconductor device technologies based on 'wide bandgap' semiconductors, including SiC, GaN, AlN and others. Applications include: power electronics for electric vehicles, electric motors, photovoltaic inverters and more; RF communication devices; UVC-LED devices for disinfection; Laser diodes and sensor applications and more.
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