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High-Performance On-chip Spectrometer for Space Applications
Completed
TRL 5 (started at 3, targeting 5)
Description
The program will develop a spectrometer with chip-scale footprint and performance rivaling high-end benchtop spectrum analyzers leveraging an innovative digital Fourier Transform (dFT) architecture, which uniquely enables exponential scaling of performance. Specifically,the Phase II project will build on the accomplishments from Phase I and fabricate the photonic circuits via AIM Photonics Si photonics foundry service. The chips will then be packaged in a commercial packaging house to establish a robust optical, thermal, and mechanical interface with other components in the spectrometer module. We will also develop the second generation electronics using custom-designed components such that the module can be co-integrated in a single matchbox-sized package. We will also mature the data acquisition and processing algorithm and develop a user application with easy-to-use graphic user interface. The project will thus lead to a market-ready, plug-and-play spectrometer module product. The proposed program will pioneer a high-performance chip-scale infrared spectrometer in response to Topic T8.07 Photonic Integrated Circuits. Unlike conventional spectrometers which are bulky, costly and fragile benchtop instruments, the chip-scale spectrometer will offer significant advantages in terms of Size, Weight, Power, and Cost (SWaP-C). It will directly address space applications such as surface and atmospheric analysis on CubeSats and planetary landers, monitoring of volatile organic compound (VOC) contaminants in spacecraft cabin atmospheres, and point-of-care diagnostics for astronauts. In addition, it also constitutes the centerpiece for numerous other applications including spectroscopic sensing, wavelength monitoring for lasers and optical communication channels, nondestructive structure testing, and medical imaging based on optical coherence tomography. The Phase II project will build on the accomplishments from Phase I and fabricate the PICs via AIM Photonics’ Si photonics foundry service. The PICs will then be packaged in a commercial packaging house to establish a robust optical, thermal, and mechanical interface with other components in the spectrometer module. We will also develop the second generation electronics using custom-designed components such that both the PIC and the electronics can be co-integrated in a single matchbox-sized package. We will also mature the data acquisition and processing algorithm and develop a user application with easy-to-use GUI. The project will thus lead to a market-ready, “plug-and-play” spectrometer module product.
Benefits
Surface and atmospheric analysis on CubeSats and planetary landers Monitoring of volatile organic compound (VOC) contaminants in spacecraft cabin atmospheres Point-of-care diagnostics for astronauts Food and water sensing Chemical, petrochemical, agrochemical and pharmaceutical process control Environmental contaminant detection Telecom and datacom channel monitoring
Details
| Technology area | Sensors and Instruments |
| Program | Small Business Innovation Research/Small Business Tech Transfer (SBIR/STTR) |
| Lead organization | Goddard Space Flight Center, Greenbelt, MD |
| Start date | 2022-11-30 |
| End date | 2025-01-31 |
Project contacts
Listed on TechPort itself — the most direct way to ask about this specific project.
How to get involved
This is early/mid-stage (TRL 5) — the most realistic path in is NASA SBIR/STTR, which funds small businesses and research institutions to develop technology aligned with NASA's needs (equity-free, phased funding). Check whether a current SBIR/STTR solicitation topic overlaps with this project's technology area, or contact the project directly (above) to ask.
None of these are guaranteed paths for this specific project — TechPort itself doesn't have an "apply" button. Reaching out to the contact(s) above with a specific question is usually the fastest way to find out what's actually open.