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Entangled Photon Pair Source Based On Thin-Film Lithium-Niobate-On-Insulator Photonic Integrated Circuits
Completed
TRL 2 (started at 2, targeting 4)
Description
Herein, PSI propose a system-on-chip (SoC) solution for an entangled photon pair source (EPPS) based on thin-film lithium niobate on insulator (TFLNOI) photonic integrated circuits (PIC). Using integrated photonic devices such as fiber coupler, waveguide, modulator, splitter/combiner and micro-ring, the proposed EPPS can generate and process the entangled photons with high efficiency and speed. In phase I effort, we developed theoretical models to study the spontaneous parametric down conversion (SPDC) conversion efficiencies based on both hybrid and ridge waveguide LNOI PIC designs. We have successfully demonstrated an in-situ monitored periodically poling process with small poling periods and large poling gaps. Leveraging other on-going PSI projects, we have also fabricated and characterized the key PIC components for the proposed EPPS chip, including low-loss waveguides, fiber coupler, high extinction splitter/combiner, micro-ring resonator and high-speed modulator. The phase I result paved a solid foundation toward a high-efficiency EPPS PIC chip. In phase II, we will continue the PIC components development focusing on the ridge waveguide designs, and experimentally demonstrate all the key PIC components. We will further refine the periodically poled LNOI (PPLNOI) process with improved accuracy and automation. Through the collaboration with RIT, our subcontractor, who has significant experiences in quantum photonic system testing and characterization, we will demonstrate the entanglement of the SPDC generated photon pair. Lastly, we will perform initial integration and packaging for the EPPS chip based on advanced photonic wire-bonding technology. Based on our pioneer work in TFLNOI PICs development and with our successful experiences in commercialization of SBIR research efforts, PSI is poised to develop, package, qualify and commercialize the proposed EPPS chip for tomorrows quantum communication demands. Fundamental investigations of quantum phenomena and of the mathematical formalism behind them lead the way in our evolving understanding of the nature of information itself. Applying this newfound understanding opens up seemingly unlimited potential in the improved sensing, information processing, and secure communication, which, however, is severely limited in real applications by experimental validations that far lag behind. One of the reasons is the lack of a standard, reliable, high-efficient and low-cost quantum light source. The state-of-art entangled photon generation is realized by the SPDC process in periodically poled lithium niobate platforms, including thin-film LNOI substrate. However, most of the system only demonstrated SPDC photon pair generation and still need extensive signal processing off the chip. In addition, since the SPDC process is sensitive to pump signal conditioning, temperature and phase matching, it is practically impossible for other people to repeat and thus use the quantum photon source in a reliable way. •System level modeling, simulation and optimization of the entangled photon pair (EPPS) chip •Continue development and improvement of the PPLNOI setup and process •Develop ridge waveguide based LNOI PICs •Demonstration of high-efficiency SHG/SPDC using PPLNOI PICs •Key component demonstration and characterization •The proposed deliverables include: •Kickoff meeting, interim and final reports •Experimental demonstration and documentation of high-efficiency SPDC process using PPLNOI PIC and demonstration of entanglement of the generated photon pairs •An integrated EPPS with pump fiber input and signal/idler fiber outputs (phase II)
Benefits
High quality entangled photon pair is needed almost in all quantum technologies from quantum communication to quantum computing. As NASA explore deep space in the next decades, reliable, secure and high-volume data communication is in urgent demands. Having a high-efficiency, high-speed, low SWaP-C, reconfigurable, integratable PIC-based entangled photon source will not only meet the challenge for many current system, but will also enable many new applications such as quantum internet, high-sensitive sensing and quantum computation. Rapid development in quantum information technology demands high-efficiency, reliable and integrated quantum light source. Similarly, photon-based quantum computing also requires entangled photon generation as well as complicated processing. The potential commercial market of the proposed PIC chip is vast. To this end, a SOC PIC-based source is the only viable solution to meet the requirements.
Details
| Technology area | Communications, Navigation, and Orbital Debris Tracking and Characterization Systems |
| Program | Small Business Innovation Research/Small Business Tech Transfer (SBIR/STTR) |
| Lead organization | Glenn Research Center, Cleveland, OH |
| Start date | 2022-12-20 |
| End date | 2025-12-19 |
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