Fiber-to-chip fusion splicing for low-loss photonic packaging with space applications

Photonect’s novel technology described in this proposal permanently attaches an optical fiber to a silicon chip using fusion splicing with methods and components that are scalable to high volume manufacturing, tolerant to mechanical and thermal stress, and limit loss. NASA has conveyed their need for coupling approaches and components resulting in low misalignment tolerances, which is directly addressed by Photonect’s technology. Currently, NASA views high efficiency coupling as losses less than 6 dB per attachment, which Photonect has drastically reduced with their technology. Photonect has gathered preliminary data showing their ability to easily fuse optical fibers to chips with extremely low losses around 1 dB in room temperature environments. However, to explicitly amend Photonect’s technology for space applications, coupling losses across a wide range of temperatures must be determined, as well as reliability of the fused spot in space impacted by thermal expansion. Photonect is confident that regardless of the temperature, their technology will result in losses much less than NASA’s requested 6 dB. Successful results from this Phase I application will get NASA one step closer to having increased accessibility to PIC technologies, as Photonect’s technology will allow for easy, reliable photonic packaging. Since Photonect’s solution is specifically for packaging photonic devices, there is a massive range of applicability for the types of technologies that this solution will benefit. Photonect’s solution can be used to package any PICs that contribute to reduced SWaP of scientific instruments and subsystems or any PICs that increase the robustness of equipment involved in launch, space travel, and entry and landing. Enabling faster, less expensive, and easier photonic packaging makes PICs utilizing large numbers of optical fibers more feasible, granting access to new technologies that facilitate new scientific discoveries.

NASA has explicitly called out their interest in photonic integrated circuits (PICs) for use with 3D mapping, spectroscopic LiDAR systems, sensors for rovers, landers, and probes, and processing of radiofrequency, microwave, submillimeter, and terahertz signals. PICs for advancement in these areas will inexplicably be beneficial to NASA, enabling new technologies that allow NASA to enable small spacecraft platforms and wearable devices for astronauts, all leading to uncovering new scientific discoveries.

Photonect plans to target optical transceiver companies, based on need established during I-Corps interviews. With the unceasing advancements being made in telecommunications, data centers, sensors, aerospace, laptops, and televisions, Photonect does not expect the need for their solution to dissipate over time, rather, the need for this product will continue to increase.

This is early/mid-stage (TRL 6) — the most realistic path in is NASA SBIR/STTR, which funds small businesses and research institutions to develop technology aligned with NASA's needs (equity-free, phased funding). Check whether a current SBIR/STTR solicitation topic overlaps with this project's technology area, or contact the project directly (above) to ask.

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