Additive Insulative Layer for Thermal Protection System

The Heatshield for Extreme Entry Environmental Technology (HEEET) project started as a solution to the difficult entry temperatures and conditions. Its design is robust for the extreme environments that it needs to survive. HEEET Thermal Protection Systems (TPS) is fabricated with two different layers. The first is a dense carbon layer that is meant to be thermally ablative (forebody) and the second is a phenolic less dense weave that acts as an insulation layer. These heavy applications were developed for the Adaptable Deployable Entry Placement Technology (ADEPT) program. Recently NASA Ames Research Center (ARC) is exploring other options using this system to produce robust materials that can be scaled to environmental conditions for Mars and low earth orbit (LEO) and other planetary entry. This hybrid manufacturing solution that will utilize the tight weave of the carbon layer and the low fiber volume of the phenolic thermal insulation. The application will use the weaving process established by Bally Ribbon Mills (BRM) and needle punched layer that will be developed with BRM engineering and Thomas Jefferson University (formerly Philadelphia University / Philadelphia Textile) engineering and lab equipment. The BRM team will develop a TPS that can have thermal layers added after the weaving process using needle punching techniques.

The proposed technology for aeroshell manufacturing offers an innovative perspective on re-entry vehicles system, including the principles of design for manufacturability as key points to reduce mass, delivery time and costs of the final product. The deployable aeroshell concept will prove itself as a viable thermal protection system (TPS) for entry, descent and landing of future exploration class payload missions such as Mars.

The proposed development of a nonwoven and HEEET hybrid material concept will pave the way for future development of specific materials for quickly adaptable entry, decent and landing systems with specific need thermal protection systems. This modifiable system will be essential in reducing cost and manufacturing time of thermal protection systems that do not need to withstand extreme conditions.

This is early/mid-stage (TRL 4) — the most realistic path in is NASA SBIR/STTR, which funds small businesses and research institutions to develop technology aligned with NASA's needs (equity-free, phased funding). Check whether a current SBIR/STTR solicitation topic overlaps with this project's technology area, or contact the project directly (above) to ask.

None of these are guaranteed paths for this specific project — TechPort itself doesn't have an "apply" button. Reaching out to the contact(s) above with a specific question is usually the fastest way to find out what's actually open.