Chip-scale Large-aperture, Ultrawide-angle LiDAR

In this program, we aim to pioneer a chip-scale packaged platform to enable efficient coupling from single-mode photonic integrated circuits (PICs) to a large-area (several millimeters in diameter or larger), diffraction-limited beam in response to Topic T8.07 Photonic Integrated Circuits. We further aim to leverage this technology to realize a chip-scale optical engine for light detection and ranging (LiDAR) with unprecedented ultrawide field-of-view (FOV), low loss, and high frame rate. Upon success, this optical coupling interface will significantly facilitate the implementation of PIC technologies in space missions (e.g., navigation, intersatellite communications, and remote sensing), where coupling of PICs with a large-area free-space beam is the norm. Moreover, the light-weight, compact, and high-performance LiDAR will address a wide spectrum of space applications spanning science missions, space exploration systems, and aeronautics. Specific examples include remote sensing of oceans and earth atmosphere, unmanned lander guidance and control, as well as real-time detection atmospheric hazards such as turbulence and wind shear. In addition to the strong NASA relevance, the LiDAR will also broadly impact commercial applications such as robotic control, unmanned aerial vehicle (UAV) navigation, automotive sensing, and consumer electronics.

The light-weight, compact, and high-performance LiDAR will address a wide spectrum of space applications spanning science missions, space exploration systems, and aeronautics. Specific examples include remote sensing of oceans and earth atmosphere, unmanned lander guidance and control, as well as real-time detection atmospheric hazards such as turbulence and wind shear.

The LiDAR will also broadly impact commercial applications such as robotic control, unmanned aerial vehicle (UAV) navigation, automotive sensing, and consumer electronics.

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