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Characterization of C-18150 Additively Manufactured material
Completed
Description
This team (Dr. T. Gregory Guzik of LaSPACE, Dr. Shengmin Guo of LSU, and Dr. Michael M Khonsari of LSU) will target NASA Commercial Space Capabilities Office’s research call CSCO-2017-01 entitled “Characterization of C-18150 Additively Manufactured Material” The objective of the proposed research is to evaluate the quality of copper-alloy (C-18150) parts made by a powder bed fusion additive manufacturing process—selective laser melting (SLM). This Louisiana team has expertise and facilities to carry out all required tasks listed under the RFP for project CSCO-2017-01. In specific, the proposing team will characterize the SLM copper-alloy, C-18150, in the as-built condition and also optimize the heat treatment process to maximize material properties. In addition, this team will conduct thermal physical property measurements for C-18150 samples.
Details
| Technology area | Thermal Management Systems > Thermal Protection Components and Systems > Thermal Protection Materials |
| Program | Established Program to Stimulate Competitive Research (EPSCoR) |
| Lead organization | Louisiana State University and Agricultural & Mechanical College, Baton Rouge, LA |
| Start date | 2018-09-01 |
| End date | 2019-08-31 |
Project contacts
Listed on TechPort itself — the most direct way to ask about this specific project.
- T G Guzik
- Michael M Khonsari
- Shengmin Guo
How to get involved
This is a mature technology (TRL 7+) — the realistic path in is usually NASA's Technology Transfer Program: licensing an existing NASA patent, or a Space Act Agreement to use NASA facilities/expertise directly. NASA also runs a startup licensing program with no upfront fee for companies formed to commercialize a specific NASA technology.
None of these are guaranteed paths for this specific project — TechPort itself doesn't have an "apply" button. Reaching out to the contact(s) above with a specific question is usually the fastest way to find out what's actually open.