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HOTTech Electronics Fabrication
Completed
TRL 3 (started at 3, targeting 5)
Description
Standard integrated circuit (IC) logic electronics for planetary instrumentation/operations are Si based. However, Si-based and other electronics are limited in operation such that they cannot adequately function in extreme high-temperature and radiation environments, including at Venus surface temperatures. Previously, Venus surface conditions have proven so challenging that no Venus landers based on sheltered conventional electronics have returned more than ~2 h of data. The potential for new Venus surface mission exploration has been enabled by developments of high-temperature electronics such as NASA Glenn Research Centers (GRC) silicon carbide (SiC) junction-gate field-effect transistor (JFET) ICs and the associated packaging to allow operations without any protection from the 460°C, 91 atmosphere caustic Venus surface environmental conditions. The GRC SiC JFET IC approach is by far the most viable technology for Venus surface applications given its present maturity, demonstrated extreme-environment operational capabilities, and the ability to form sufficiently complex ICs. A major distinguishing aspect of the GRC JFET IC work is the long-term durability of these circuits and packaging at or above 465 °C, which no other IC approaches have accomplished even for less-complicated circuits. This includes operation of the electronics and packaging in simulated Venus surface conditions for 60 days and over a year at 500°C in room air. Further, the technology has now advanced to the level to enable multichip high-temperature circuit boards to enable a range of capabilities as described below. Other GRC electronics work has shown operation of circuits across a total temperature range from low (–190 °C) to high temperatures (961°C), a span more than 1,000 °C. Such capabilities have possible significant impact on applications even beyond Venus and planetary exploration, such as aeronautics and deep-well drilling operations. Based on this unique experience and understanding gained in demonstrating electronics of unmatched extreme temperature durability, NASA GRC and partners/subcontractors will oversee the development, design, and implementation of SiC transistors and ICs for a range of Venus surface applications in the High Temperature Operating Technologies (HOTTech)-21 project. This includes circuits for the HOTTech-21 projects (: 1) High Temperature UV near field Imager/General Electric Research; 2) A Venus Durable Actuator and Electronics System/Honeybee Robotics; 3) High-Temperature MEMS based Venus Seismometer/NASA GRC; and 4) Non-Volatile, Low Power, and High Density SiC Memory for Future Venus Mission/NASA GRC. (Please see: https://www1.grc.nasa.gov/space/pesto/space-vehicle-technologies-current/high-operating-temperature-technology-hottech/). In each case, specialized electronics will be designed and fabricated to meet the needs of the individual projects. This electronics significantly advances the state-of-the-art of what is available in high temperature, Venus durable electronics enabling specific functionality appropriate to the individual project application. For example, specialized high-temperature electronics will be designed, fabricated, and tailored to operate the seismic sensor for long-lived Venus surface operations. Integration and testing of these electronics developed in this HOTTech Electronics Fabrication task are both core to demonstrating the seismometer operation, but also a foundation for its maturation. The resulting seismic sensor and a core set of electronics will be demonstrated in Venus simulated conditions in the NASA Glenn Extreme Environment Rig (GEER) for a planned 60 days of operation. Likewise, for the other HOTTech-21 projects, the core capabilities of the NASA GRC high temperature electronics development will be design applied for different aspects of circuit development and implementation, with the end product demonstrated for 60 days in Venus simulated conditions in GEER. This work includes electronic circuit design, layouts, fabrication, packaging, and testing.
Benefits
The primary science objective of the overall HOTTech-21 activity is to develop and mature technologies that will enable, significantly enhance, or reduce technical risk for in situ missions to high-temperature environments with temperatures approaching 500˚C or higher for the robotic exploration of high-temperature environments such as the Venus surface, Mercury, or the deep atmosphere of Gas Giants. The goal is to develop technology areas that will enable a long-lived lander that can survive at least 60 days at 500˚C. This HOTTech Electronics Fabrication project develops unique high temperature electronics to enable specific aspects of that long-lived lander mission, e.g., a high temperature seismometer or imager, to be operational on the Venus surface for an extended duration.
Details
| Technology area | Sensors and Instruments > In Situ Instruments and Sensors > Extreme Environments Related to Critical System Health Management |
| Program | Hot Operating Temperature Technology (HOTT) |
| Lead organization | Glenn Research Center, Cleveland, OH |
| Start date | 2022-05-01 |
| End date | 2026-01-31 |
Project contacts
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How to get involved
This is early/mid-stage (TRL 3) — the most realistic path in is NASA SBIR/STTR, which funds small businesses and research institutions to develop technology aligned with NASA's needs (equity-free, phased funding). Check whether a current SBIR/STTR solicitation topic overlaps with this project's technology area, or contact the project directly (above) to ask.
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