VIPER: Versatile Imager Platform with Enhanced Radiation hardness

Alphacore will develop the capability to provide critical elements for very large space based imagers. These imagers will have sensitivity to UV, visible and NIR wavelengths. The proposed large-format, high-resolution focal plane arrays will meet the following specifications: 8k x 8k pixels Four-sides buttable  (three-sides is the minimum requirement) Pixel size: <~7 µm  (goal is 5 um) Read noise: ~1 e- rms Dark signal ~1x10-4 e-/pixel/sec Operating temperature >150 K Radiation hard The 4-sides buttable readout integrated circuit (ROIC) will be designed in a specific 65nm CMOS Image Sensor (CIS) fabrication process. This process provides photodiode options with enhanced UV and NIR sensitivity. It also provides stitching for fabrication of sensors that are larger than the reticle size (typically 25mm x 25mm) and advanced wafer stacking which allows practically 100% fill factor at small pixel area and 4-side buttable designs. 4-sides buttable FPAs and ROICs provide much higher level of flexibility in construction very large imagers, than 3-sides or 2-sides buttable devices. This provides great benefit to NASA’s future missions. The ROIC will be the bottom layer in this stacked die FPA solution. The ROIC will be designed to be as versatile as possible so that different detector arrays can be bonded to it. The FPA will be implemented as radiation-hardened. Alphacore has extensive experience as a supplier of radiation hard electronics, as well as a radiation test services, to numerous customers. In the image sensor area, we have provided hardened solutions to extreme radiation environments in nuclear applications. Space and strategic radiation environments has been our other focus. Note that image sensor radiation hardening requires specific techniques for hardening the photodiodes and the pixel circuitry and these techniques are relatively unknown as compared to radiation hardening by design (RHBD) techniques for other types of CMOS ICs.

The FPA is a match to the Habex UV, visible light and NIR imagers.As a successor to Hubble Space Telescope (HST), HabEx will have two observatory science instruments that will provide unique capabilities from the ultraviolet (UV) through the near-infrared (near-IR), enabling groundbreaking solar system, Galactic, and extragalactic science from the vantage of space. This technology is also a match to LUVOIR Ultraviolet MultiObject Spectrograph (LUMOS) and LUVOIR High-Definition Imager (HDI). The 2020 Astrophysics Decadal Survey underscores the importance of advancing FPA technology across UV, optical, and NIR wavelengths to facilitate groundbreaking scientific discoveries in the coming decade. These FPAs will enable astronomers to explore the universe with unprecedented sensitivity, resolution, and coverage, addressing key questions in astrophysics and cosmology. Since this is a universal FPA, it can be applied to applications both in space and for terrestrial applications. Possible applications drone defense and detection, high energy laser applications, and hypersonic missiles.

This is early/mid-stage (TRL 2) — the most realistic path in is NASA SBIR/STTR, which funds small businesses and research institutions to develop technology aligned with NASA's needs (equity-free, phased funding). Check whether a current SBIR/STTR solicitation topic overlaps with this project's technology area, or contact the project directly (above) to ask.

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