Ultra-high resolution integrated arrayed waveguide spectrometer with reusable delay lines for exoplanet detection

New Integration Photonics, Inc. is proposing to developan ultra-high resolving power (R 150,000), high throughput (70%)spectrometer leveraging arrayed waveguide gratings (AWGs) on a Si3N4/SiO2 photonic integrated chip (PIC). Our groundbreaking approach introduces a reusable delay line (RDL) as a transformative alternative to the traditional multitude of waveguides. This innovation not only drastically reduces the devices footprint, potentially by a factor of 1000, but also enhances chip stability and reduces the weight, power, and cost (Swap-C) . The spectrometer PIC will feature an inventive integration with a linear InGaAs detector array at the output and will incorporate fiber coupling at the input. This strategic design is meticulously crafted to yield a highly functional device housed within a butterfly package. The result is a substantial reduction in form factor ( 20 cm) when compared to prevailing competitors (~ 200 cm). This cutting-edge, high-resolution, and high-throughput integrated spectrometer are poised to make significant contributions, not only in applications such as the detection of exoplanets using the Precision Radial Velocity (PRV) method, but also in commercial marketswhere bulk spectrometer are currently used. The potential impact of this technology is underscored by its innovative design and promising advancements in performance, reliability and cost. The proposed photonic integrated spectrometers introduces four key advancements to enhance conventional AWG spectrometers, making an ultra-high resolving power, high-throughput on-chip spectrometer more achievable. It addresses challenges associated with increased device footprint and optical phase errors by replacing numerous arrayed waveguides with a single reusable delay line (RDL), reducing chip size and eliminating the need for phase error compensation. Parabolic tapers are strategically implemented to minimize cross-coupling and phase errors, optimizing throughput and resolving power. A three-stigmatic-points compensation approach is proposed for integration, achieving a flat focal-plane and minimizing aberrations for enhanced imaging quality. The compact spectrometer, with the integration of butt-coupled input fiber and output CCD array, surpass competitors with a form factor below 20 cm³. Future integration into consumer electronics is feasible with the chip's size below 1 cm³. These innovations collectively enhance the overall performance of on-chip spectrometers. Technical Objectives: Design and Fabrication of Single-Stage RDL-AWG This objective targets a single-stage Reusable Delay Line Arrayed Waveguide Grating (RDL-AWG) with a resolution (R = 150,000) within a 20 nm bandwidth. Design and Fabrication of Cascaded Two-Stage RDL-AWG Our second objective involves the design of a cascaded two-stage RDL-AWG, optimizing for a flat-top spectrum and incorporating three-stigmatic-points compensation. Implementation of Parabolic Taper Design Introduces a parabolic taper design to address coupling issues between adjacent tapers, refining the trade-off between total throughput and neighboring effects. Integration with 1-D CCD Array The final objective involves direct coupling of the photonic chip to a 1-D CCD array, with meticulous cleavage studies and a detailed packaging procedure. Proposed Deliverables:   The synthesis of our effort will yield integrated spectrometer prototypes on a Si3N4/SiO2 platform, boasting high spectral resolving power (R~150,000), exceptional throughput (~70%), and a wide operational bandwidth (20 nm), featuring a fiber pigtailed input for seamless integration, and a direct CCD readout for a compact design. The Phase II effort aims to enhance stability, accuracy, replicability, and scalability, with deliverables integrated into a butterfly package (<20 cm³).

The development of a high resolving power, high throughput integrated spectrometer holds the promise of creating an exceptionally compact instrument with versatile applications across various NASA-related projects. Potential uses include sensors, lidar, laser ranging, as well as medical and health applications. New Integration Photonics, Inc. is committed to exploring opportunities for collaboration with NASA, aiming to integrate this innovative technology into future NASA missions, including endeavors related to exoplanet detection. Our compact spectrometers hold significant potential for various applications, such as academic labs, on-field geological measurements for mining or oil & gas exploration, pharmaceutics, food & beverages, agriculture, medical point-of-care applications, and quantum and environmental sensing. Looking ahead, the integrated chip holds the promise of full integration into consumer electronics.

This is early/mid-stage (TRL 3) — the most realistic path in is NASA SBIR/STTR, which funds small businesses and research institutions to develop technology aligned with NASA's needs (equity-free, phased funding). Check whether a current SBIR/STTR solicitation topic overlaps with this project's technology area, or contact the project directly (above) to ask.

None of these are guaranteed paths for this specific project — TechPort itself doesn't have an "apply" button. Reaching out to the contact(s) above with a specific question is usually the fastest way to find out what's actually open.