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Micro-rapid Prototyping from 3-D CAD to Final 3-D Shape seeks to replicate some of the capabilities of the much more expensive direct write e-beam in the fabrication of microdevices. This technique has the promise to be orders of magnitude cheaper and faster than traditional techniques based on gray scale e-beam lithography.
The goal of this task is to create a maskless process for sample 500 µm 3-D objects. Specific objectives are to
(1) Develop 3-D CAD computer models and suitable resist processes while working on dry etch techniques to hit the 500 µm goal
(2) Demonstrate optical gray-scale pattern formation and
(3) Test concepts on commercial state of the art maskless machines capable of gray scale lithography.
This technology could be beneficial for detectors for Earth Science or Astrophysics missions, or miniaturized devices on SmallSat missions. Sample applications could include microlens arrays for IR detectors, fuel emitters for micropropulsion, or injectors for THz sensing.
This technology could be beneficial for commercial communication or resource monitoring missions.
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This is a mature technology (TRL 7+) — the realistic path in is usually NASA's Technology Transfer Program: licensing an existing NASA patent, or a Space Act Agreement to use NASA facilities/expertise directly. NASA also runs a startup licensing program with no upfront fee for companies formed to commercialize a specific NASA technology.
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