Multifunctional Electronics Core Substrate Configurable Electronics Functionality with Stacked Silicon and Multi-Chip Modules (MECSC)

Integration of a mix of heterogeneous electronic device technologies (silicon, III-V, passive, etc.) into a single multifunctional substrate core. Based on the development  and implementation of 2.5D and 3-D interconnect and interposer packaging technologies.  Target small sat deep space transponder/RF comms boards into one board for >50% size and weight savings.

A custom multifunctional core substrate scheme comprised of next generation polyimide, ceramic and/or silicon materials will be designed to integrate new 2.5D and 3-D interconnect technologies into producing a significant size and power reduced RF transponder.  Development of heterogeneous flip chip attachment to low loss substrates, embedded RF waveguides and passives (R,L,C) and completely plug in/stackable Multichip Modules (MCM) will be required to meet this goal.

Substantially reduce the size of RF systems such as radio and communication boards and demonstrate the cost effectiveness of 2.5D packaging technology into low volume production.

This is early/mid-stage (TRL 3) — the most realistic path in is NASA SBIR/STTR, which funds small businesses and research institutions to develop technology aligned with NASA's needs (equity-free, phased funding). Check whether a current SBIR/STTR solicitation topic overlaps with this project's technology area, or contact the project directly (above) to ask.

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