Additively Manufactured Electronics for Extreme Environmental Conditions

The main Phase II objectives are to achieve these specifications: 1) Develop the capability to monitor in situ the resistance of interconnects over extreme temperature and vibration; 2) evaluate interconnect resistance changes and durability over a temperature range of -190C to 125C; 3) assess interconnect durability under vibration conditions; 4) measure connector resistance changes and durability over the same temperature range of -190C to 125C; and 5) evaluate connector durability under vibration conditions. Electronic circuits have a lot of complexity and are comprised of diverse materials, each with different properties. Key mechanical properties, such as tensile strength, compression, and elasticity, can change across temperature ranges. A significant issue with mismatched materials is the difference in the coefficient of thermal expansion (CTE), which can affect mechanical integrity. These diverse materials also include composite materials, such as silver flake in thermoplastic, which must be accounted for. Interconnects, a critical area in electronics, often involve multiple material sets and are the weak link in circuits.Asignificant portion of failures in circuits occurdue to large temperature changes. Interconnects are the most common point of failure, often due to material mismatch, surface contamination, temperature fluctuations, shock, vibration, corrosion, and aging. In Phase I, we conducted preliminary studies on interconnects in BGA and QFN packages. Connectors pose an additional challenge, as they unite two different fabrication techniques into a single package. While AMEs flexibility in shape, process, and materials is advantageous and has shown promise, important tests and studies are required to fully understand its capabilities. These findings will lay the foundation for future AME builds within proper guidelines for fabricating device and ensuring operational confidence. Electronic circuits have a lot of complexity and are comprised of diverse materials, each with different properties. Key mechanical properties, such as tensile strength, compression, and elasticity, can change across temperature ranges. A significant issue with mismatched materials is the difference in the coefficient of thermal expansion (CTE), which can affect mechanical integrity. Interconnects, a critical area in electronics, often involve multiple material sets and are the weak link in circuits. A significant portion of failures in circuits occur due to material mismatch, surface contamination, temperature fluctuations, shock, vibration, corrosion, and aging. In Phase I, we conducted preliminary studies on interconnects in BGA and QFN packages. While AME's flexibility in shape, process, and materials is advantageous and has shown promise, important tests and studies are required to fully understand its capabilities. These findings will lay the foundation for future AME builds within proper guidelines for fabricating devices and ensuring operational confidence. The main Phase II Objectives are two-fold: 1. Summarize NASA's requirements and guidelines for extreme environmental electronics 2. Transition AME solutions to meet NASA's requirements and guidelines for extreme environmental electronics. To achieve this, solutions for interconnects and connectors for AME will be a major focus. There are five critical steps to establish a foundation for enhancing AME electronics for extreme environmental conditions: 1. Develop the capability to monitor (in situ) the resistance of interconnects over extreme temperature and vibration 2. Evaluate interconnect resistance changes and durability over a temperature range of -190C to 125C 3. Assess interconnect durability under vibration conditions 4. Measure connector resistance changes and durability over the same temperature range of -190C to 125C 5. Evaluate connector durability under vibration conditions. Proposed Deliverables: 7 Quarterly Reports Material Properties & Characterization Report 5 Completed Devices 1 Process Documentation Report (discussing fabrication of demonstration devices) 1 Cumulative Report 

The potential NASA applications can be seen through the AME designs that have high performance under extreme environmental conditions (in space/lunar exploration) or under high vibration conditions (during space transit/travel). This Phase II proposal can have a major impact on electronic survivability in lunar applications. High performance under extreme environmental and vibration conditions would be relevant to the Department of Defense and commercial aerospace organizations. Additively Manufactured electronics that are temperature, weather, and vibration resistant would be useful in building vehicles, aircraft, and weaponry.

This is early/mid-stage (TRL 4) — the most realistic path in is NASA SBIR/STTR, which funds small businesses and research institutions to develop technology aligned with NASA's needs (equity-free, phased funding). Check whether a current SBIR/STTR solicitation topic overlaps with this project's technology area, or contact the project directly (above) to ask.

None of these are guaranteed paths for this specific project — TechPort itself doesn't have an "apply" button. Reaching out to the contact(s) above with a specific question is usually the fastest way to find out what's actually open.