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IMPedance Analysis & Certification Technnology (IMPACT)

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Description

Proposed Goals/Objectives: (1) Integrate EIT with TPS certification, (2) Extend 2D EIT to system scale (>24”). Stretch: develop impedance correlation models for other TPS material properties (thermal conductivity, phase, strain) via impedance spectra to enhance EIT cert. & diagnostic capabilities. Vision: Low cost and rapid in-situ certification of heatshields at any scale including Human M2M missions.

Benefits

Deliverables: (1) Optimized EIT system for TPS certification processes, (2) Impedance correlation models for material thermal conductivity/phase, (3) Higher temperature testing (>700 °C), system scale testing (DFLY/ESM), (4) Papers: EIT for TPS crack detection, EIT for resin sensing, EIT for microstructure sensing

Details

Technology areaEntry, Descent, and Landing
ProgramAgency Independent Research and Development (A-IRAD)
Lead organizationAmes Research Center, Moffett Field, CA
Start date2025-11-01
End date2026-09-30

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