PIC-Based Physical Sensors with Low Noise and Extreme Dynamic Range

The proposed PIC‐based physical sensor platform leverages advanced integrated photonic circuits and MEMS structures to achieve ultra‐low noise and extreme dynamic range. By integrating a silicon nitride waveguide on a flexible silicon cantilever—with a bulk proof mass—and employing on‐chip acousto‐optic modulation (AOM), our design enables heterodyne detection that converts minute mechanical displacements into measurable optical phase shifts. The sensing arm, which undergoes phase modulation due to cantilever vibrations, is combined with a frequency‐shifted reference arm, allowing demodulation of the phase over many optical fringes. This innovative approach extends the intrinsic dynamic range (IDR) well beyond the limits of conventional interferometric sensors—targeting an IDR of up to 160 dB—while maintaining a displacement noise floor on the order of 10 fm⁄√Hz. The compact chip-size sensor package reduces size, weight, and power (SWaP) compared to traditional systems with similar performance. Phase 1 will focus on developing a laboratory prototype using PICs with integrated cantilevers and off‐chip AOMs to validate the heterodyne detection concept, model system nonidealities (including oscillator and mixer noise), and establish a solid foundation for full integration in Phase 2. This work promises to bridge the gap between high‐sensitivity optical sensors and the demanding dynamic range requirements of next‐generation inertial measurement applications.

The proposed sensor platform directly addresses critical NASA mission requirements for precision navigation, guidance, and scientific measurements. Its ultra‐low noise floor and extended dynamic range enable high‐resolution inertial measurements essential for spacecraft attitude determination and trajectory control. In applications such as planetary exploration and lunar surface operations (e.g., Artemis III), the sensor’s ability to capture both subtle vibrations and large shock events will enhance the accuracy and reliability of onboard inertial measurement units (IMUs). Additionally, the sensor’s compact, low‐SWaP design is ideal for high‐altitude balloon experiments and infrasonic monitoring, where weight and power constraints are paramount. The integration of on‐chip AOMs and heterodyne detection techniques minimizes reliance on bulky external optics, reducing system complexity and improving robustness in extreme environments encountered during launch, space transit, and planetary entry. Overall, this technology offers NASA a transformative capability to achieve zero‐compromise performance in inertial sensing, with direct benefits in mission safety, cost efficiency, and scientific data quality across a broad range of aerospace and exploration applications. The proposed PIC‐based sensor platform has broad commercial and defense relevance beyond NASA. In aerospace and defense sectors, ultra‐low noise, high‐dynamic range inertial sensors are vital for unmanned aerial vehicles, precision-guided munitions, and advanced fighter aircraft navigation systems. The sensor’s capability to accurately measure both small vibrations and extreme motion events makes it ideal for structural health monitoring and dynamic control in high-performance platforms. In industrial settings, the technology can be applied to robotics, automotive systems, and process control, where high-resolution motion detection and vibration analysis are critical for efficiency and safety. Telecommunications and data centers stand to benefit from the integrated acousto-optic modulators for on-chip optical signal processing, offering enhanced performance in compact, energy-efficient transceivers. Moreover, the platform’s low-SWaP footprint positions it as a promising solution for next-generation IoT devices and consumer electronics requiring precision miniaturized sensors. By delivering a scalable, robust, and cost-effective sensing solution, this innovation addresses critical market needs across multiple sectors, driving advances in performance, energy efficiency, and system integration.

This is a mature technology (TRL 7+) — the realistic path in is usually NASA's Technology Transfer Program: licensing an existing NASA patent, or a Space Act Agreement to use NASA facilities/expertise directly. NASA also runs a startup licensing program with no upfront fee for companies formed to commercialize a specific NASA technology.

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