High-Temperature, Substrate-Agnostic Fine-Line Additive Metallization with Advanced Interconnects

High-temperature electronics are crucial for NASA missions involving extreme environments. The field of Additively Manufactured Electronics shows potential in providing enabling capability for future NASA missions that have very severe or unique volume constraints. Specifically, NASA has identified a specific need to be able to deposit conductor material on high-temperature, compatible insulating substrates. Manufacturing methods are able to print conductors and dielectrics at needed resolutions. However, there is a lack of data demonstrating operational reliability in extreme high temperature environments. Further, the effectiveness of material adhesion and material behavior at elevated temperatures should be understood given the extreme temperature target environments as well as demonstrating the capability of repeatable processing. International FemtoScience is proposing the development of an extreme environment electronics system for enabling field deployment of advanced Additive Manufacturing technologies. This technology will utilize novel Active Diamond Metal Matrix Braze conductors applied to any type of high temperature ceramic substrate, thus substrate-agnostic. This is accomplished via Aerosol Jet Printing that can deposit 10-micron wide conductors onto oxides, carbides, and nitrides, and can do so on 3-D geometries. 2-micron interconnect technology achieved with novel method of laser writing conductors inside nanodiamond films will also provide further interconnection capabilities for high power, Wide Bandgap devices such as Silicon Carbide and Gallium Nitride semiconductors. International FemtoScience, University of Arkansas, and University of Tennessee Spece Institute will perform research and development to demonstrate that the materials selected in the proposed extreme environment additive manufacturing electronics system have the capability to perform repeatable processing to demonstrate integration methods for extreme performance conductors.

The proposed technology may be leveraged to support the following NASA missions: Venus Exploration: Venus has surface temperatures around 465°C (869°F). The proposed high-temperature extreme environment electronics system will enable prolonged robotic exploration of Venus, allowing instruments to operate without extensive cooling systems. Jet Engines: High-temperature electronics are used in jet engines to monitor and control performance under extreme conditions. The proposed high-temperature extreme environment electronics system will improve efficiency and reliability, which are vital for both space and atmospheric flight. Deep Space Probes: Electronics that can withstand extreme cold and heat are essential for deep space missions. The proposed high-temperature extreme environment electronics system components will ensure reliable operation over long durations and vast distances, where temperature fluctuations are significant. Power Management Systems: In spacecraft, high-temperature electronics are used in power management and control systems. The proposed high-temperature extreme environment electronics system components will improve efficient operation under severe thermal swings, reducing the need for bulky thermal management solutions. Seismic Sensors: For missions like those to Venus, high-temperature electronics are used in MicroElectroMechanical Systems-based seismometers. The proposed high-temperature extreme environment electronics system components will increase these sensors’ ability to operate on the planet's surface for extended periods, providing valuable data on seismic activity. The market for high high-temperature electronics is growing rapidly. The commercial market is being propelled by several industries such as electronics, aerospace and defense, automotive, and optoelectronics in which there is demand for semiconductor devices that are capable of operating reliably in harsh environments, including extremely high temperatures. There are various market needs that will benefit from the technology to be proposed in this program. The proposed high-temperature extreme environment electronics system components would have commercialization opportunities in the Aerospace and Defense industry by providing electronic packaging solutions for applications in extremely harsh environments such as hypersonic flight. Department of Defense agencies developing hypersonic flight capability include Missile Defense Agency, Navy, Air Force, and Army. Primary defense contractors include Lockheed Martin, Northrop Grumman and Raytheon Missiles and Defense. The proposed technology can also have direct and immediate application for a range of commercial aerospace, power generation and industrial processes. For example, one commercialization opportunity where this technology can supply a direct and near-term market need is through on-blade deployment of wireless telemetry systems in natural gas power generation turbines, which require a minimum operating temperature of 400 °C for F-class turbines, and upwards of 500 °C for G-class turbines. Additionally, on-blade components must survive continual centrifugal loading upwards of 15,000 g’s, thus demanding incredibly robust electronic packaging systems. Another example of a commercialization opportunity is aerospace turbine engines, which can see similar required operational temperatures combined with even higher centrifugal loading requirements (approaching 100,000 g’s) as well as shock and vibration conditions.

This is a mature technology (TRL 7+) — the realistic path in is usually NASA's Technology Transfer Program: licensing an existing NASA patent, or a Space Act Agreement to use NASA facilities/expertise directly. NASA also runs a startup licensing program with no upfront fee for companies formed to commercialize a specific NASA technology.

None of these are guaranteed paths for this specific project — TechPort itself doesn't have an "apply" button. Reaching out to the contact(s) above with a specific question is usually the fastest way to find out what's actually open.