HEAT: High-temperature Electronics in Advanced Thermostructures

The HEAT (High-Temperature Electronics in Advanced Thermostructures) project addresses NASA’s critical need for additively manufactured electronics (AME) capable of operating in extreme thermal environments (500°C–800°C). Future missions to Venus, solar probes, and high-temperature propulsion systems require structurally embedded electronics that can withstand prolonged exposure to extreme conditions without bulky shielding or cooling systems. Traditional space-grade electronics degrade at these temperatures, necessitating innovative AME solutions for long-duration survivability. HEAT leverages Direct Ink Writing (DIW) and laser-etched vias to integrate high-temperature conductive pathways such as tungsten into ceramic matrix composites (CMCs) and carbon-carbon (C/C) structures. This enables sensor integration, power distribution, and signal transmission directly within spacecraft materials, eliminating failure-prone mechanical interconnects. Unlike conventional wire-bonded electronics, HEAT’s embedded architecture provides superior thermal stability, mechanical robustness, and reduced mass, allowing mission-critical electronics to function in Venus-like and solar probe conditions. NASA missions to Venus, solar probes, and high-temperature propulsion systems require electronics capable of surviving 500°C–800°C for extended durations, where most space-grade electronics degrade above 300°C, necessitating bulky shielding that increases mass and complexity. HEAT introduces a novel additively manufactured electronics approach that embeds high-temperature conductive pathways (e.g., tungsten) directly into ceramic matrix composites and carbon-carbon structures, eliminating failure-prone interconnects and the need for external thermal enclosures. Compared to state-of-the-art electronics, HEAT offers 10X improvement in operational lifetime at 500°C+ and enables a 30–40% reduction in thermal shielding mass. Unlike wire-bonded or surface-mounted electronics, HEAT’s Direct Ink Writing and laser-etched vias allow seamless integration of sensors, power distribution, and data transmission directly into structural components. This fundamentally transforms NASA’s high-temperature electronics design, ensuring lighter, more robust, and longer-lasting mission-critical systems.

HEAT supports Venus landers (DAVINCI, VERITAS), solar probe missions, and high-temperature propulsion diagnostics by enabling integrated, long-duration electronics in extreme thermal environments. Additionally, NASA’s Marshall Space Flight Center (MSFC) is actively developing propulsion monitoring solutions, making it a key partner for HEAT’s transition to high-temperature aerospace systems. Beyond space exploration, HEAT has significant potential in hypersonic vehicle electronics, nuclear reactor monitoring, geothermal energy systems, and industrial process control. Its ability to replace failure-prone interconnects and improve sensor survivability in extreme environments makes it a transformative solution for aerospace, defense, and commercial high-temperature applications. Phase I will focus on optimizing deposition techniques for refractory metal interconnects, validating thermal and electrical performance, and demonstrating a functional prototype in a simulated high-temperature environment. The technology will transition to TRL 5–6 in Phase II through NASA-funded spaceflight demonstrations, ensuring mission success in the harshest known environments.

This is a mature technology (TRL 7+) — the realistic path in is usually NASA's Technology Transfer Program: licensing an existing NASA patent, or a Space Act Agreement to use NASA facilities/expertise directly. NASA also runs a startup licensing program with no upfront fee for companies formed to commercialize a specific NASA technology.

None of these are guaranteed paths for this specific project — TechPort itself doesn't have an "apply" button. Reaching out to the contact(s) above with a specific question is usually the fastest way to find out what's actually open.