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Low Temperature Atmospheric Pressure Plasma Sterilization Shower, Year 2

Completed TRL 4 (started at 2, targeting 4)

Description

The goal is to develop an atmospheric plasma jet that is capable of depositing a wide variety of materials on flexible substrates such as paper, plastic, cotton and thin metal foils. This would be a dry alternative to inkjet printing. There has been an increased interest in fabricating electronic devices on flexible substrates with enhanced emphasis on recyclable materials. Atmospheric pressure plasma may be a low cost solution to provide 100% efficiency with respect to sterilization. It creates oxygen atoms, ions which are effective in sterilization in addition to the help from the UV of the plasma, ion bombardment and the mild heat the plasma produces. This combination of effects is the reason for the 100% efficiency. We have already constructed a single plasma jet and ignited the plasma at atmospheric pressure. This minimize the risk. The nozzle diameter now is 5 mm. Power consumption is extremely low. Major Milestones for FY16: We will show at the end of CIF 100% killing of e-coli within minutes which is not possible using dry heat. Multi jet design and demonstration.

Benefits

We will be able to contribute to NASA instrument proposals, Mars in situ resource utilization (ISRU) proposals, proposals to US Army and NIH. The approach can potentially be extended to printed electronics applications where plasma jets can carry the material to be deposited. Printed electronics, flexible electronics will have major impact on future missions.

Details

ProgramCenter Innovation Fund: ARC CIF (ARC CIF)
Lead organizationAmes Research Center, Moffett Field, CA
Start date2015-10-01
End date2016-09-30

Project contacts

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How to get involved

This is early/mid-stage (TRL 4) — the most realistic path in is NASA SBIR/STTR, which funds small businesses and research institutions to develop technology aligned with NASA's needs (equity-free, phased funding). Check whether a current SBIR/STTR solicitation topic overlaps with this project's technology area, or contact the project directly (above) to ask.

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