Large Format Uncooled Focal Plane Array, Phase II

Black Forest Engineering has identified innovative modifications in uncooled focal plane array (UFPA) architecture and processing that allows development of large format long wavelength infrared (8-14 ?m) imaging sensors to meet future NASA system requirements for a light weight, low power, and radiation tolerant imager. These modifications allow development of bolometer-based large format UFPA, with a pixel pitch of 20-?m and 1024x768 pixel elements with sensitivity comparable to commercially available UFPAs with 30-?m pixel pitch. The identified modifications are applicable to amorphous silicon bolometer-based UFPAs, such as those manufactured by Raytheon Commercial Infrared in Dallas, Texas.

This is a mature technology (TRL 7+) — the realistic path in is usually NASA's Technology Transfer Program: licensing an existing NASA patent, or a Space Act Agreement to use NASA facilities/expertise directly. NASA also runs a startup licensing program with no upfront fee for companies formed to commercialize a specific NASA technology.

None of these are guaranteed paths for this specific project — TechPort itself doesn't have an "apply" button. Reaching out to the contact(s) above with a specific question is usually the fastest way to find out what's actually open.