Reliable Direct Bond Copper Ceramic Packages for High Temperature Power Electronics

The proposed program will develop highly reliable, hermetic, Si3N4 ceramic multichip modules to integrate commercially available SiC power devices to build power electronic modules for reliable operation above 500ºC in extreme environments of space exploration. The Phase I program will demonstrate a reliable direct bond copper (DBC) process for Si3N4 substrates, develop high current carrying hermetic feedthroughs, an innovative transient liquid phase (TLP) die attach, and a monometallic wire bonding capable of reliable operation above 500ºC; and fabricate and test a hermetic single-chip module.

Potential applications include motor drives, power supplies, and well logging; high power microwave applications such as phased array radar; automotive applications such as combustion sensors; DoD's mostly electric aircraft and tank programs, monitoring nuclear reactors, and aeronautical engine controls.

Future NASA missions outlined in Decadal Survey of Solar System Exploration all involve operation in extreme environments of temperature, pressure, and radiation. Venus Surface Exploration and Venus Sample Return, both of which require surface operation including sample acquisition from 15-20 cm depth of hard rock and in-situ sensing (temperature, pressure etc.), will significantly benefit from the proposed program.

This is early/mid-stage (TRL 6) — the most realistic path in is NASA SBIR/STTR, which funds small businesses and research institutions to develop technology aligned with NASA's needs (equity-free, phased funding). Check whether a current SBIR/STTR solicitation topic overlaps with this project's technology area, or contact the project directly (above) to ask.

None of these are guaranteed paths for this specific project — TechPort itself doesn't have an "apply" button. Reaching out to the contact(s) above with a specific question is usually the fastest way to find out what's actually open.