Ultra Low Temperature Electronics (ULTE)

Develop electronics that maximize the science return from Europa lander by allow the lander to last longer on the surface and enable additional science instruments. This goal will be achieved through: Electronic Packaging - Dramatically reduce electronics volume and mass through the use of advanced packaging. Low Power Multi-Core Computing - Develop an advanced embedded processing module that enables reduction significant reduction in power and processing mass. Cold Capable Electronics & Cameras - Reduce the power required for survival & operational heating by allowing electronic assemblies to operate and survive at temperatures beyond the Mil-Std temperature range of -55 to +125_C.

NASA funded: This technology significantly reduces the mass and power over the current Europa Lander baseline avionics suite. The benefits of the improved mass/volume/power enable an extended set of science requirements (e.g. additional instrument or increased lifetime). NASA unfunded: This technology will benefit future deep space missions as bridges the GAP in SWAP between existing rad750-based avionics systems and the those that will eventually be based on the HPSC. Nation: Significantly contributes to scientific discovery on the surface of Europa.

This is early/mid-stage (TRL 5) — the most realistic path in is NASA SBIR/STTR, which funds small businesses and research institutions to develop technology aligned with NASA's needs (equity-free, phased funding). Check whether a current SBIR/STTR solicitation topic overlaps with this project's technology area, or contact the project directly (above) to ask.

None of these are guaranteed paths for this specific project — TechPort itself doesn't have an "apply" button. Reaching out to the contact(s) above with a specific question is usually the fastest way to find out what's actually open.