High Performance 3D Photonic Integration for Space Applications

In this work, Freedom Photonics will team with University of California, Santa Barbara to develop a hybrid integration platform that integrates yielded, best-of-breed active optical components with low-cost, high functionality Silicon Photonics components in a manner that is compatible with foundry fabrication. This will be performed in a highly manufacturable manner, using passively aligned pick-and-place technology to place the semiconductor components on the interposer substrate to form a system in package-type of integration platform for space photonic applications. The approach is based on a novel 3D hybrid integration approach developed at UCSB that is scalable, low cost, reliable, and that demonstrates superior thermal performance.

Chip-scale integrated miniaturized, yet high performance photonic systems can significantly impact a wide range of applications including and in addition to NASA space communication and control needs. These applications include other terrestrial communications applications, including both free-space and fiber optic links, a range of sensing applications and potential optical waveform generating sources. Freedom Photonics will work with NASA and communications equipment manufacturers in the development and commercialization of these chip-scale photonic integration technologies to a variety of NASA applications and markets.

1. Optical fiber sensor systems which with significantly lower cost has the potential to become pervasive in structural monitoring of buildings, vehicles and other structures. 2. Optical links such as free-space optical or hybrid fiber-wireless systems where implementation to date have been limited due to the performance and cost of components compared to conventional transmission links and digital technologies. 3. Medical markets, a potentially very large volume market where a range of non-invasive optical sensing and imaging technologies are emerging including optical coherence tomography. 4. Chipscale integrated systems and subsystems for large data centers and supercomputer data transfer interconnects. Low-cost, ruggedized integrated photonics is a requirement for meeting these demands through efficient advanced photonic integrated circuit technology, in particular with regard to the large volume of components needed in a large datacenter or supercomputer.

This is early/mid-stage (TRL 3) — the most realistic path in is NASA SBIR/STTR, which funds small businesses and research institutions to develop technology aligned with NASA's needs (equity-free, phased funding). Check whether a current SBIR/STTR solicitation topic overlaps with this project's technology area, or contact the project directly (above) to ask.

None of these are guaranteed paths for this specific project — TechPort itself doesn't have an "apply" button. Reaching out to the contact(s) above with a specific question is usually the fastest way to find out what's actually open.