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Extreme Imaging

Completed TRL 3 (started at 2, targeting 3)

Description

Sandia will provide, at no cost to JPL, detector wafers that have been bonded to custom CMOS ROICs. JPL will use MBE and ALD to create nanoengineered surfaces that improve sensitivity and stabilize/isolate the detectors against radiation-induced surface damage. This program will produce superlattice-doped photodiodes and imaging arrays for integration and test in Sandia's Z-pinch facility.

Benefits

JPL and Sandia will collaborate on the development and demonstration of imaging detectors with 1 ns frame rates. Using a pulse-dilation camera, we expect to achieve timing resolution better than 10 ps.

Details

Technology areaSensors and Instruments > Remote Sensing Instruments and Sensors > Detectors and Focal Planes
ProgramCenter Innovation Fund: JPL CIF (JPL CIF)
Lead organizationJet Propulsion Laboratory, Pasadena, CA
Start date2016-10-01
End date2017-07-01

Project contacts

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How to get involved

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