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Extreme Imaging
Completed
TRL 3 (started at 2, targeting 3)
Description
Sandia will provide, at no cost to JPL, detector wafers that have been bonded to custom CMOS ROICs. JPL will use MBE and ALD to create nanoengineered surfaces that improve sensitivity and stabilize/isolate the detectors against radiation-induced surface damage. This program will produce superlattice-doped photodiodes and imaging arrays for integration and test in Sandia's Z-pinch facility.
Benefits
JPL and Sandia will collaborate on the development and demonstration of imaging detectors with 1 ns frame rates. Using a pulse-dilation camera, we expect to achieve timing resolution better than 10 ps.
Details
| Technology area | Sensors and Instruments > Remote Sensing Instruments and Sensors > Detectors and Focal Planes |
| Program | Center Innovation Fund: JPL CIF (JPL CIF) |
| Lead organization | Jet Propulsion Laboratory, Pasadena, CA |
| Start date | 2016-10-01 |
| End date | 2017-07-01 |
Project contacts
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How to get involved
This is early/mid-stage (TRL 3) — the most realistic path in is NASA SBIR/STTR, which funds small businesses and research institutions to develop technology aligned with NASA's needs (equity-free, phased funding). Check whether a current SBIR/STTR solicitation topic overlaps with this project's technology area, or contact the project directly (above) to ask.
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