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Completed TRL 3 (started at 2, targeting 3)
Detector technology for NASA applications is progressing to more complex multilayer circuits to gain advances in array size or detector performance. Chemical Mechanical Planarization (CMP) is a technique that maintains high fabrication yield and increases feature density in multilayer structures. While outside foundries offer CMP for a limited set of materials, we propose to leverage in-house and federal government facilities to develop custom CMP techniques for the specific materials we need, thereby enabling breakthrough enhancements in detectors, multiplexers, and microwave devices for astrophysics missions. We will develop the means to apply CMP to enable new device geometries and smaller, self-aligned feature size critical to the performance of many superconducting devices, such as detectors, amplifiers, and wiring.
Chemical Mechanical Planarization technology enabling higher performance detectors, multiplexers, and microwave devices for astrophysics missions. Examples include x-ray microcalorimeters with better spatial and energy resolution, and array wiring and multiplexers for large format far infrared detector arrays.
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