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Completed TRL 2 (started at 1, targeting 2)
This effort will focus on evaluating AM for backshell applications due to the more benign environments and large number of critical interfaces and closeout features that lead to integration challenges. The team will: develop formulations suitable for printing in collaboration with ORNL/LLNL; characterize initial formulations (ease of printing, out time, properties, room temp cure) to downselect suitable formulations for prototype fabrication; prototype fabrication for arc jet testing; explore feasibility of directly printing TPS on a representative substructure, such as a cyanate ester, to alleviate the bonding challenges associated with traditional TPS; and exercise ESM developed computational materials tools to predict properties of the AM compositions a priori.
TPS AM is immature with very limited evaluations completed to date for heatshield or backshell applications. AM can: produce customized parts for heatshields with complex features (ex. closeouts on the backshell); can provide a route for an on-orbit repair approach (potentially for Orion); and can help explore in-situ resource utilization for TPS manufacturing. AM is more suited to backshell/benign environment applications as a feasibility study due to TPS backshell microstructures being suitable to AM processes (microstructures such as syntactic foams) and the large number of complex backshell closeouts leading to integration challenges. Thermal Protection Materials (TPS) Additive Manufacturing (AM) effort demonstrated the feasibility of AM for backshell or benign thermal protection applications. We effectively leveraged established industry practices where possible by partnering with leaders in AM. We engaged projects to identify areas where TPS AM brings substantial benefit (mass reduction, complexity, near net shape fabrication, on-orbit repair). We have two downselected formulations that have been characterized (property testing complete) and these two formulations are being prepared for arc jet testing in early 2020. We are also engaged with partners to potentially deliver a printed backshell system for a small flight unit in 2020.
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