Stacked Miniaturized And Radiation Tolerant Intelligent Electronics (SMARTIE)

With the desire of many current and future Space missions to utilize advanced artificial neural networks, high data bandwidth sensors, and perform real-time, on-board automated decisions new technology is needed to make available state-of-the-art compute capabilities. Irvine Sensors proposes a Stacked Miniaturized And Radiation Tolerant Intelligent Electronics (SMARTIE) technology that uses advanced packaging to integrate three, high performance, compute tiles into a folded-flex module consisting of an off-the-shelf multi-core processor, graphics processing unit (GPU), and memory; and combines these together with a system controller providing adaptive redundancy, background data management, and inter-tile communication to mitigate radiation effects. Each compute tile consists of a SnapDragon 855 system-on-chip, low power DDR4 with built-in ECC, and MRAM with side-channel access for data scrubbing, synchronization, and triple-modular redundancy support. The compute tiles are connected using an adaptive redundancy controller that provides the system with the capability of instantly enabling redundancy across compute tiles for critical computations or exploiting the redundant modules for peak compute power. Non-volatile MRAM reduces start-up and shut-down cycles of each compute tile to provide very high peak compute capabilities for extremely intensive, real-time decision algorithms while consuming minimal average power. Each compute tile achieves performance of over 100GFlops processing capability, nearly 2TFlops of FP16 GPU performance, and 7TOPS of AI engine compute consuming less than 10W.

Accelerate mission development and reduce risk by developing critical components and subsystems for advanced instruments and observing systems

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